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Case Studies

Below you will find a selection of interesting Case Studies covering a range of laser marking and laser cutting applications. We aim to update these for you on a regular basis so you should check back every so often to see what’s new.

Laser Marking of Stainless Steel Devices

Laser Marking of Stainless Steel Device: Safety Sensor Casing

In the world of precision engineering, the laser marking of stainless steel devices plays a crucial role in ensuring the traceability and identification of components. At Thinklaser Limited, one of our legacy projects involved the laser marking of stainless steel safety sensor casings, demonstrating the capabilities of our advanced Lightblade laser systems. In this case

Nike laser cutting and marking system

Laser Cutting and Marking Machine for Nike

This article explores how we designed and manufactured a laser cutting and marking machine for Nike to drive its success and meet the evolving demands of consumers. Nike, a global leader in athletic footwear and apparel, constantly innovates its production processes to enhance efficiency, precision, and customization. Laser cutting and marking machines have become indispensable

FashionLeisure
The LightWriter Laser Engraving Marking Machine Bespoke Industrial Laser Engraving Machine Custom laser marker

Laser and Robotics handling in-board of LightWriter marking system

Laser and Robotics Handling solution housed within Lightwriter Chassis – Ceres Customer requirement was to mark ID matrix codes onto stainless steel plates used in the production of fuel cells.  The purpose of the code was to provide internal tracking of test data within the manufacturing process control. The Lightwriter chassis was chosen as the

Power
LightWriter laser marking system

Laser Marking Heat Shrink Tubing: Bespoke Machine for BAE Systems.

Laser marking heat shrink tubing is an advanced method for creating permanent, high-contrast marks on the surface of heat shrink materials. This technique is widely used in industries such as electronics, aerospace, automotive, and telecommunications for labelling cables, wires, and other components. In this article, we explore the process of laser marking on heat shrink

Aerospace
Pulsed YAG cutting silicon wafers

Laser Cutting Machine – Westcode Semiconductors

Laser Cutting Machine – Westcode Uk Ltd Initial brief was for the design and supply of a machine that would cut circular disks, in varying layouts, from 100 mm silicon wafers.  The process needed to be automatic and capable of upgrading to 150 mm origin wafers at a later date.  The customer also required qualification

Semiconductor